Accelsius, a leader in innovative two-phase, direct-to-chip cooling technology, and iM Data Centers, a leader in advanced manufacturing of high-performance modular data centres with expertise in transforming legacy facilities into sustainable, High-Performance Computing (HPC) data centres, has announced a strategic partnership to deliver sustainable, scalable data centre cooling solutions.
This collaboration will support the growing demand for HPC and AI workloads initially at iM’s Miami data centre, set to open in Q1 2025.
Located in one of the world’s most network-dense cities, the Miami facility spans 100,000 square feet, offering 10MW scaling to 40MW of power. This purpose-built centre is fed from two utility substations with expandable infrastructure.
Following iM Data Centers’ recently commissioned fully modular Pittsburgh HPC Data Center, the Miami site further demonstrates the company’s commitment to sustainable IT practices while providing some of the highest power densities and most advanced cooling solutions in the market, making it an ideal partner for Accelsius.
The Miami facility will showcase Accelsius’ NeuCool Thermal Simulation Rack (TSR) with integrated Load Simulation Sleds (LSS). This system demonstrates energy-efficient advanced direct-to-chip liquid cooling capabilities, showing how the NeuCool platform efficiently and safely manages heat for next-generation AI CPU and GPU workloads.
iM Data Centers’ modular design and flexible colocation options allow clients to evaluate HPC capabilities while touring the Miami facility. This collaboration helps data centre operators meet modern computing demands with minimal environmental impact.
