Innovations address the critical need for optimized power across both single-mode fiber (SMF) and short-reach multi-mode fiber (MMF) links in 800G and 1.6T optical transceiver applications.
Broadcom has expanded its 200G/lane DSP PHY portfolio with the introduction of Sian3 and Sian2M, purpose-built for the demanding connectivity requirements of AI/ML clusters.
These innovations address the critical need for optimized power across both single-mode fiber (SMF) and short-reach multi-mode fiber (MMF) links in 800G and 1.6T optical transceiver applications.
The rapid growth of AI workloads is driving demand for increased bandwidth and interconnect density in AI clusters. Optical interconnect power is a major factor limiting cluster scalability. Sian3 and Sian2M DSPs, along with its comprehensive portfolio of 200G/lane lasers, provide what’s pitched as unprecedented levels of power efficiency and cost optimization for next-generation AI infrastructure.
Sian3, a state-of-the-art 3nm 200G/lane PAM4 DSP PHY, delivers the industry’s lowest power consumption for 800G and 1.6T optical transceivers utilizing SMF. Sian3 builds upon the success of Broadcom’s Sian2 DSP, enabling over 20% power reduction for both EML and SiP based 1.6T modules.
Sian2M offers a specialized, optimized solution for 800G and 1.6T short-reach MMF links within AI clusters.
By integrating VCSEL drivers and leveraging Broadcom’s market-proven 200G VCSEL technology, Sian2M unlocks new levels of performance and efficiency for short-reach connectivity. This technology builds on Broadcom’s established track record in optical interconnects, having successfully deployed over 50 million channels of 100G VCSELs in AI networks.
Broadcom’s Sian3 and Sian2M DSP PHYs, developed in conjunction with its portfolio of 200G/lane EML and CWL lasers and its market-proven VCSELs, empower module developers to rapidly address the growing demand for 200G optics in AI. Broadcom’s 200G EML and PD are already shipping in volume, delivering the quality, reliability, and performance required for AI optical interconnects.
“Broadcom’s Sian family of DSP PHYs is foundational to the low-power, high-bandwidth optical connectivity needed for AI/ML clusters,” said Vijay Janapaty, Vice President and General Manager of the Physical Layer Products Division, Broadcom.
“Our new 3nm Sian3 delivers over 20% power reduction for 1.6T optical modules, while Sian2M with integrated VCSEL drivers and 200G VCSELs brings cost and power efficiency to short-reach links. These innovations enable our customers to scale AI clusters to meet the demands of growing AI workloads.”
